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Full-Auto Wafer Grinder

Full-Auto Wafer Grinder series is the core facility specialized in wafer fabrication. Thru several years of research and study in wafer grinding, we are familiar with more than twenty kinds of grinding solutions including first to fourth generation of semiconductors.

Dual Spindle Wafer Grinder

The outline and load-bearing structure adopt our latest cast iron frame, marble platform and support structure, and the support of the grinding wheel spindle is made of sand casting.

Double Side Polisher

TY-13-6B Double Side Polisher grind, lapping & polish both flat faces of the components at the same time.It is widely used for Sapphire substrate,Silicon Wafers,Filter Glass, optical glass, Sapphire Watch Glass,aluminum, copper, stainless steel, bearing steel, ceramics, quartz crystal, other materials, etc.

Two-sided Grinder for Sapphire

TY-9B Two-sided Grinder for Sapphire grind & polish both flat faces of the components at the same time.It is widely used for Quartz wafers, ceramics(Aluminum oxide, zirconium oxide, aluminum nitride, beryllium oxide, boron nitride, silicon nitride, silicon carbide, silicon nitride, indium sulfide, bismuth telluride, barium titanate, strontium titanate,、piezoelectric ceramics), optical glass, sapphire, alloy steel, stainless steel, tungsten steel, iron and other metals or non-metals.

Dual Face Lapping&Polishing Machines

TY-6B Dual Face Lapping&Polishing Machines grind & polish both flat faces of the components at the same time. It is widely used for Quartz wafers, ceramics(Aluminum oxide, zirconium oxide, aluminum nitride, beryllium oxide, boron nitride, silicon nitride, silicon carbide, silicon nitride, indium sulfide, bismuth telluride, barium titanate, strontium titanate,、piezoelectric ceramics), optical glass, sapphire, alloy steel, stainless steel, tungsten steel, iron and other metals or non-metals.

Fine Grinding Machine

The fine grinding machine is widely used for single-sided grinding and polishing of optical glass, mobile phone glass, mobile phone logo, mobile phone card tray, 12-inch silicon wafer, aluminum alloy, stainless steel, valve plate, sealing ring, petroleum mechanical seal and other products.

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